Fabrication of fine metal microstructures packaged in the bonded glass substrates

Akihito Kawamura*, Shinichi Ike, Shuichi Shoji

*この研究の対応する著者

研究成果査読

9 被引用数 (Scopus)

抄録

In order to realize fine microstructures with high aspect ratio, two kind of thick-resist-based metal molding processes were studied. A novel technique obtaining fine line/space and high aspect ratio thick photoresist patterns on a glass substrate by the simple UV lithography was developed. A three-layer resist method using reactive ion etching (PIE) for patterning thick photoresist was also examined. The former method is to use fine thin metal patterns (<1 μm) formed on the glass substrate as the exposure mask. A thick negative photoresist is coated on it and UV light is iliuminated from the backside. Perfect contact between mask and photoresist is obtained and the influence of light diffraction is also avoided. By using SU-8 as the negative photoresist, minimum line/space of 1 μm and high aspect ratio of about 5 was achieved. The metal layer is served as a seed layer for Ni electroplating as well. Metal microstructures were also fabricated by the three-layer resist method using the thick photoresist-thin SiO2-thin photoresist structure. Even an usual contact UV lithography was applied to pattern the thin photoresist layer and a usual CCP-RIE was used to etch the SiO2 and thick photoresist layer, at least 1 μm gap microstructures were obtained by the Ni electroplating. Micro-packaging method using SiO2-SiO2 bonding with hydrofluoric acid was also studied. HF bonding has a remarkable feature that the bonding of quartz-to-quartz can be obtained at low temperature (<80 C). The bonding conditions suitable for micropackaging were examined under different HF concentration, pressure, and temperature. Reasonable bond strength equal to that by the anodic bonding is obtained under high-applied pressure during bonding. Packaging method is proposed using combination of the thick-resist-based molding and the HF bonding.

本文言語English
ページ(範囲)486-493
ページ数8
ジャーナルProceedings of SPIE - The International Society for Optical Engineering
3893
出版ステータスPublished - 1999 12 1
イベントProceedings of the 1999 Design, Characterization, and Packaging for MEMS and Microelectronics - Royal Pines Resort, Aust
継続期間: 1999 10 271999 10 29

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • コンピュータ サイエンスの応用
  • 応用数学
  • 電子工学および電気工学

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