TY - GEN
T1 - Fabrication of microchannel-TEM grid for in situ liquid observation of interfacial chemical reaction
AU - Miwa, K.
AU - Kuwae, H.
AU - Sakamoto, K.
AU - Shoji, S.
AU - Mizuno, J.
N1 - Publisher Copyright:
© 2018 Japan Institute of Electronics Packaging.
PY - 2018/6/6
Y1 - 2018/6/6
N2 - We developed a novel microchannel-TEM grid that enables observation of interfacial biochemical reactions. A Y-shaped microchannel, which was sandwiched between two alumina membranes, realizes observation of interfacial reactions by lamellar flow. Reliable sealing of the microchannel was achieved by highly stable Al2O3/SU-8 bonding of 2.90 MPa at 180 °C. TEM images indicate the TEM grid has sufficient electron transparency and it was successfully fabricated without microchannel distortion. These results suggest that proposed TEM grid will become a powerful tool for revealing mechanisms of chemical reactions.
AB - We developed a novel microchannel-TEM grid that enables observation of interfacial biochemical reactions. A Y-shaped microchannel, which was sandwiched between two alumina membranes, realizes observation of interfacial reactions by lamellar flow. Reliable sealing of the microchannel was achieved by highly stable Al2O3/SU-8 bonding of 2.90 MPa at 180 °C. TEM images indicate the TEM grid has sufficient electron transparency and it was successfully fabricated without microchannel distortion. These results suggest that proposed TEM grid will become a powerful tool for revealing mechanisms of chemical reactions.
KW - TEM grid
KW - interfacial chemical reaction
KW - liquid phase observation
UR - http://www.scopus.com/inward/record.url?scp=85048786470&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85048786470&partnerID=8YFLogxK
U2 - 10.23919/ICEP.2018.8374305
DO - 10.23919/ICEP.2018.8374305
M3 - Conference contribution
AN - SCOPUS:85048786470
T3 - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
SP - 284
EP - 287
BT - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
Y2 - 17 April 2018 through 21 April 2018
ER -