Fabrication of multilayer interconnection using ultraviolet nanoimprint lithography

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

Advanced large scale integrated circuits (LSI) and smart sensor systems require nanoscale interconnection to transmit signals. In this work, an approach to realize multilayer interconnection based on ultraviolet nanoimprint lithography (UV-NIL) technology and copper electroplating is discussed. UV-NIL is a low-cost, mass-production technology. Nanoscale dot array patterns and line array patterns of nickel and copper were formed on a silicon substrate using UV-NIL in combination with electroplating. Imprinted 220 nm hole patterns and 150 nm line patterns were formed on photocurable resin with high dimensional accuracy. Using these resin patterns as a mask layer, 245 nm metal dot and 195 nm metal line array patterns were successfully fabricated by electroplating.

本文言語English
ホスト出版物のタイトル4th International Conference on Networked Sensing Systems, INSS
ページ130-133
ページ数4
DOI
出版ステータスPublished - 2007 12 1
イベント4th International Conference on Networked Sensing Systems, INSS - Braunschweig, Germany
継続期間: 2007 6 62007 6 8

出版物シリーズ

名前4th International Conference on Networked Sensing Systems, INSS

Conference

Conference4th International Conference on Networked Sensing Systems, INSS
CountryGermany
CityBraunschweig
Period07/6/607/6/8

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Control and Systems Engineering

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