This paper presents the fabrication methods of polymer and metal three-dimensional (3-D) micromesh structures. The photoresist micromesh structures were formed using multiple inclined UV exposure from the backside of the SU-8 coated glass substrate with metal patterns. A few micrometer-size pillars and pores were realized by optimizing the UV lithography conditions. The 3-D macroporous-mesh Ni structures were also fabricated using electroplating. The inverse-mesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni meshes of about 3 μm in diameter were obtained by this method.
|ジャーナル||Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers|
|出版ステータス||Published - 2004 12 1|
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