Fabrications of micro-channel device by hot emboss and direct bonding of PMMA

J. Mizuno*, T. Harada, T. Glinsner, M. Ishizuka, T. Edura, K. Tsutsui, H. Ishida, S. Shoji, Y. Wada

*この研究の対応する著者

研究成果

18 被引用数 (Scopus)

抄録

We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50um wide and a 30um deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm x 20mm x 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water. The optical loss around bonded interface was also evaluated and no increase in the light absorption was observed. The above results confirmed that the hot emboss and direct bonding technologies for micro-channel manufacturing using the PMMA plates realizes high performance micro channel devices.

本文言語English
ホスト出版物のタイトルProceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004
編集者W. Badawy, W. Moussa
ページ26-29
ページ数4
出版ステータスPublished - 2004 12 1
イベントProceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004 - Banff, Alta., Canada
継続期間: 2004 8 252004 8 27

出版物シリーズ

名前Proceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004

Conference

ConferenceProceedings - 2004 International Conference on MEMS, NANO and Smart Systems, ICMENS 2004
国/地域Canada
CityBanff, Alta.
Period04/8/2504/8/27

ASJC Scopus subject areas

  • 工学(全般)

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