Fiber-optic temperature sensor based on difference of thermal expansion coefficient between fused silica and metallic materials

Xuefeng Li*, Shuo Lin, Jinxing Liang, Yupeng Zhang, Hiroshi Oigawa, Toshitsugu Ueda

*この研究の対応する著者

研究成果: Article査読

45 被引用数 (Scopus)

抄録

In this paper, we report a novel fiber-optic Fabry-Perot interferometric (FFPI) temperature sensor based on the difference of thermal expansion coefficient between fused silica and metallic materials. The sensor head is made by a single-mode fiber (SMF). A gold film and a nickel film are sputtered and electroplated on the surface of the SMF. Then, a microcavity is micromachined by focused ion beam (FIB) milling. Because the thermal expansion coefficient of nickel is about 20 times of fused silica, the different thermal expansions force the sensor head to bend when the temperature is high or low. Its temperature sensitivity is over 14 pm°C in a wide range from 79°C to +70°C. And the coefficient of determination R 2 is excellent (over 0.995). Moreover, the metallic cylinder can reinforce the cavity spot of the fiber sensor, so that this kind of sensor can work in harsh environments. For the first time to the best of our knowledge, we report this type of FFPI temperature sensor based on difference of thermal expansion coefficient between fused silica and metallic materials.

本文言語English
論文番号6112705
ページ(範囲)155-162
ページ数8
ジャーナルIEEE Photonics Journal
4
1
DOI
出版ステータスPublished - 2012

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 原子分子物理学および光学

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