Fine-pitch hybrid bonding with Cu/Sn microbumps and adhesive for high density 3D integration

Masaki Ohyama, Jun Mizuno, Shuichi Shoji, Masatsugu Nimura, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

In this study, we developed single-pitch hybrid bonding technology for high density 3D integration. To realize the single-pitch, smaller than 10-μm pitch, hybrid bonding, 8 μm-pitch Cu/Sn microbumps and nonconductive film (NCF) were used. The planar structure to simultaneously bond was formed by chemical mechanical polishing (CMP). After the planarization, the Cu/Sn bumps and NCF were simultaneously bonded at 250 °C for 60 s. Cross sectional observation of the bonded sample by scanning electron microscope (SEM) indicated that 8 μm-pitch bump bonding was carried out successfully and the NCF filled the 2.5-μm gap between the chip and substrate without significant voids. In addition, a tensile test was performed as a mechanical reliability test. The tensile strength was 3.86 MPa. From SEM observation of the fractured surface after the tensile test, the fractured surface of the bumps was intermetallic compound (IMC) layer between Cu and Sn. These results indicated that hybrid bonding was effective method for single-pitch bonding and underfilling.

本文言語English
ホスト出版物のタイトル2014 International Conference on Electronics Packaging, ICEP 2014
出版社IEEE Computer Society
ページ604-607
ページ数4
ISBN(印刷版)9784904090107
DOI
出版ステータスPublished - 2014 1 1
イベント2014 International Conference on Electronics Packaging, ICEP 2014 - Toyama, Japan
継続期間: 2014 4 232014 4 25

出版物シリーズ

名前2014 International Conference on Electronics Packaging, ICEP 2014

Conference

Conference2014 International Conference on Electronics Packaging, ICEP 2014
国/地域Japan
CityToyama
Period14/4/2314/4/25

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料

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