Fine-pitch interconnection by hybrid Cu/Sn-adhesive bonding for 3D integration

Masaki Ohyama, Jun Mizuno, Shuichi Shoji, Masatsugu Nimura, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

In this study, we developed 8 μm-pitch microbump bonding and encapsulating by hybrid Cu/Sn-adhesive bonding technology. As an adhesive material, we used a non-conductive film (NCF). To realize simultaneous bonding of a metal and an adhesive, planar structure was formed by chemical mechanical polishing (CMP). After the planarization, hybrid bonding was carried out at 250 °C for 60 s. From scanning electron microscopic (SEM) observation of the bonded sample, it was confirmed that 8 μm-pitch bump bonding and the NCF filling 2.5-μm gap between the chip and substrate were performed at the same time. This result indicated that hybrid bonding was effective in fine-pitch bonding and encapsulating for future three-dimensional (3D) integration.

本文言語English
ホスト出版物のタイトルProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
出版社IEEE Computer Society
ページ数1
ISBN(印刷版)9781479952618
DOI
出版ステータスPublished - 2014 1 1
イベント2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan
継続期間: 2014 7 152014 7 16

出版物シリーズ

名前Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Conference

Conference2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
国/地域Japan
CityTokyo
Period14/7/1514/7/16

ASJC Scopus subject areas

  • ろ過および分離

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