Flexible tactile sensor for shear stress measurement using transferred sub-μm-thick Si piezoresistive cantilevers

Kentaro Noda*, Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, Isao Shimoyama

*この研究の対応する著者

研究成果: Article査読

22 被引用数 (Scopus)

抄録

We propose a flexible tactile sensor using sub-m-thick Si piezoresistive cantilevers for shear stress detection. The thin Si piezoresistive cantilevers were fabricated on the device layer of a silicon on insulator (SOI) wafer. By using an adhesion-based transfer method, only these thin and fragile cantilevers were transferred from the rigid handling layer of the SOI wafer to the polydimethylsiloxane layer without damage. Because the thin Si cantilevers have high durability of bending, the proposed sensor can be attached to a thin rod-type structure serving as the finger of a robotic hand. The cantilevers were arrayed in orthogonal directions to measure the X and Y directional components of applied shear stresses independently. We evaluated the bending durability of our flexible tactile sensor and confirmed that the sensor can be attached to a rod with a radius of 10mm. The sensitivity of the flexible tactile sensor attached to a curved surface was 1.7×106Pa1on average for a range of shear stresses from1.8×103to 1.8×103Pa applied along its surface. It independently detected the X and Y directional components of the applied shear stresses.

本文言語English
論文番号115025
ジャーナルJournal of Micromechanics and Microengineering
22
11
DOI
出版ステータスPublished - 2012 11月 1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 材料力学
  • 機械工学
  • 電子工学および電気工学

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