抄録
We have achieved the 100-Gb/s/λ operation of a flip-chip interconnection 1.3-μm lumped-electrode electroabsorption modulator integrated with a distributed feedback laser module for the first time. The flip-chip interconnection provides a flatter frequency response characteristic and a higher modulation bandwidth. Clear eye opening was achieved for 103-Gb/s nonreturn to zero and equalizer-free 56-GBd 4-pulse-amplitude modulation operation after a 10-km single-mode fiber transmission.
本文言語 | English |
---|---|
論文番号 | 7113803 |
ページ(範囲) | 1699-1701 |
ページ数 | 3 |
ジャーナル | IEEE Photonics Technology Letters |
巻 | 27 |
号 | 16 |
DOI | |
出版ステータス | Published - 2015 8月 15 |
外部発表 | はい |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 原子分子物理学および光学
- 電子工学および電気工学