Flip-Chip Interconnection Technique for beyond 100-Gb/s (4 × 25.8-Gb/s) EADFB Laser Array Transmitter

Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Yuta Ueda, Hiroyuki Ishii, Ryuzo Iga, Wataru Kobayashi, Hiroaki Sanjoh

研究成果: Article査読

12 被引用数 (Scopus)

抄録

We developed a flip-chip interconnection technique that is suitable for an EADFB laser array transmitter operating at more than 100 Gb/s (4 × 25 Gb/s). The flip-chip interconnection technique provides a good thermal flow comparable to that of the conventional wire interconnection technique but with a higher modulation bandwidth and lower electrical crosstalk. For a flip-chip interconnection 112-Gb/s (4 × 27.9 Gb/s) module, the OTU4 mask margin is only 4% worse for simultaneous four-channel operation than for single-channel operation. For a flip-chip interconnection 400-Gb/s (8 × 50 Gb/s) module, we obtained clear eye openings for all eight lanes with simultaneous eight-channel operation.

本文言語English
論文番号7173428
ページ(範囲)296-302
ページ数7
ジャーナルJournal of Lightwave Technology
34
2
DOI
出版ステータスPublished - 2016 1 15
外部発表はい

ASJC Scopus subject areas

  • 原子分子物理学および光学

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