TY - JOUR
T1 - Flip-Chip Interconnection Technique for beyond 100-Gb/s (4 × 25.8-Gb/s) EADFB Laser Array Transmitter
AU - Kanazawa, Shigeru
AU - Fujisawa, Takeshi
AU - Takahata, Kiyoto
AU - Ueda, Yuta
AU - Ishii, Hiroyuki
AU - Iga, Ryuzo
AU - Kobayashi, Wataru
AU - Sanjoh, Hiroaki
N1 - Publisher Copyright:
© 1983-2012 IEEE.
PY - 2016/1/15
Y1 - 2016/1/15
N2 - We developed a flip-chip interconnection technique that is suitable for an EADFB laser array transmitter operating at more than 100 Gb/s (4 × 25 Gb/s). The flip-chip interconnection technique provides a good thermal flow comparable to that of the conventional wire interconnection technique but with a higher modulation bandwidth and lower electrical crosstalk. For a flip-chip interconnection 112-Gb/s (4 × 27.9 Gb/s) module, the OTU4 mask margin is only 4% worse for simultaneous four-channel operation than for single-channel operation. For a flip-chip interconnection 400-Gb/s (8 × 50 Gb/s) module, we obtained clear eye openings for all eight lanes with simultaneous eight-channel operation.
AB - We developed a flip-chip interconnection technique that is suitable for an EADFB laser array transmitter operating at more than 100 Gb/s (4 × 25 Gb/s). The flip-chip interconnection technique provides a good thermal flow comparable to that of the conventional wire interconnection technique but with a higher modulation bandwidth and lower electrical crosstalk. For a flip-chip interconnection 112-Gb/s (4 × 27.9 Gb/s) module, the OTU4 mask margin is only 4% worse for simultaneous four-channel operation than for single-channel operation. For a flip-chip interconnection 400-Gb/s (8 × 50 Gb/s) module, we obtained clear eye openings for all eight lanes with simultaneous eight-channel operation.
KW - 100 gigabit Ethernet
KW - 400 gigabit Ethernet
KW - Electro-absorption modulator
KW - Flip-chip devices
KW - Photonic integrated circuits
KW - Semiconductor device packaging
KW - Semiconductor laser arrays
KW - Semiconductor lasers
UR - http://www.scopus.com/inward/record.url?scp=84961926684&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84961926684&partnerID=8YFLogxK
U2 - 10.1109/JLT.2015.2462728
DO - 10.1109/JLT.2015.2462728
M3 - Article
AN - SCOPUS:84961926684
VL - 34
SP - 296
EP - 302
JO - Journal of Lightwave Technology
JF - Journal of Lightwave Technology
SN - 0733-8724
IS - 2
M1 - 7173428
ER -