Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections

K. Sakuma*, K. Toriyama, H. Noma, K. Sueoka, N. Unami, J. Mizuno, S. Shoji, Y. Orii

*この研究の対応する著者

研究成果: Conference contribution

22 被引用数 (Scopus)

抄録

Fluxless bonding can be used for fine-pitch low-solder-volume interconnections for three-dimensional large-scale integrated-circuit (3D-LSI) applications. Surface treatments with hydrogen radicals, formic acid, vacuum ultraviolet (VUV), and Ar plasma were evaluated as candidate methods for fluxless bonding. Three-m-thick Sn solders were evaluated for intermetallic-compound (IMC) bonding of 3D integration as a target material for fluxless bonding. X-ray photoelectron spectroscopy (XPS), Auger electron spectro-scopy (AES), time-of-flight secondary ion mass spectrometry (TOF-SIMS), a scanning electron microscope (SEM), and a focused ion beam scanning ion microscope (FIB-SIM) were used to examine the samples. The experiments shows solder oxides and organic contaminants on the surfaces of the micro-bumps were most effectively eliminated without flux by hydrogen radical treatment among various treatments we evaluated. Bonding strength was also improved by the hydrogen radical treatment, since the shear strength was more than 50 times stronger than that of the untreated samples.

本文言語English
ホスト出版物のタイトル2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
ページ7-13
ページ数7
DOI
出版ステータスPublished - 2011
イベント2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
継続期間: 2011 5月 312011 6月 3

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Conference

Conference2011 61st Electronic Components and Technology Conference, ECTC 2011
国/地域United States
CityLake Buena Vista, FL
Period11/5/3111/6/3

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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