TY - GEN
T1 - Fluxless bonding using vacuum ultraviolet and formic acid for 3D interconnects
AU - Sakuma, Katsuyuki
AU - Unami, Naoko
AU - Shoji, Shuichi
AU - Mizuno, Jun
PY - 2010
Y1 - 2010
N2 - We have developed a novel surface treatment process using vacuum ultraviolet (VUV) light with a wavelength of 172 nm and formic acid vapor. A previous study showed that the VUV process can help remove the organic contaminants on the bonding surfaces and improve the shear strength [1]. This new work focuses on studying the effects of VUV/O3 and formic acid treatments. The formic acid (HCOOH) vapor removes the metal oxides from the surfaces before the bonding process. Evaporated Cu/Sn and immersion Au were used for the bonding micro-bumps and bonding pads in our evaluations. Different cleaning conditions with VUV/O3, formic acid vapor, or both were compared and evaluated. X-ray Photoelectron Spectroscopy (XPS) was used to study the surface elemental composition of the micro-bumps and pad surfaces before and after the cleaning process. The photoelectron spectra of Cls, Sn3d, and Au4f were obtained with XPS. The XPS results showed the atomic carbon concentrations were significantly decreased by the VUV/O3 treatment process, while the Sn and Au concentrations were increased by the VUV/O3 and formic acid treatment because of the removal of the organic contaminants and metal oxides from the surfaces. The bonding strength of the Cu/Sn bumps was evaluated using a shear test tool. The results shows that the combination of VUV/O 3 and formic acid treatment obtains the highest average shear strength among the treatments tested, with a shear strength almost 2.5 times stronger than the untreated samples.
AB - We have developed a novel surface treatment process using vacuum ultraviolet (VUV) light with a wavelength of 172 nm and formic acid vapor. A previous study showed that the VUV process can help remove the organic contaminants on the bonding surfaces and improve the shear strength [1]. This new work focuses on studying the effects of VUV/O3 and formic acid treatments. The formic acid (HCOOH) vapor removes the metal oxides from the surfaces before the bonding process. Evaporated Cu/Sn and immersion Au were used for the bonding micro-bumps and bonding pads in our evaluations. Different cleaning conditions with VUV/O3, formic acid vapor, or both were compared and evaluated. X-ray Photoelectron Spectroscopy (XPS) was used to study the surface elemental composition of the micro-bumps and pad surfaces before and after the cleaning process. The photoelectron spectra of Cls, Sn3d, and Au4f were obtained with XPS. The XPS results showed the atomic carbon concentrations were significantly decreased by the VUV/O3 treatment process, while the Sn and Au concentrations were increased by the VUV/O3 and formic acid treatment because of the removal of the organic contaminants and metal oxides from the surfaces. The bonding strength of the Cu/Sn bumps was evaluated using a shear test tool. The results shows that the combination of VUV/O 3 and formic acid treatment obtains the highest average shear strength among the treatments tested, with a shear strength almost 2.5 times stronger than the untreated samples.
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U2 - 10.1557/proc-1249-f09-04
DO - 10.1557/proc-1249-f09-04
M3 - Conference contribution
AN - SCOPUS:78650317314
SN - 9781605112268
T3 - Materials Research Society Symposium Proceedings
SP - 299
EP - 307
BT - Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics
PB - Materials Research Society
ER -