抄録
Formation of Ni microstructure with high aspect ratio without thicker photoresist was tried by an electrcdeposition method. The Ni microprobes thicker than photoresist thickness were electrodeposited on a patterned substrate using thin photoresist patterned with UV radiation. It was important for preparing Ni microprobe with high aspect ratio to keep the overpotential of patterned cathode higher, and moreover the agitation using a paddle plating cell system was so effective to form uniform microprobes.
本文言語 | English |
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ページ(範囲) | 1150-1152 |
ページ数 | 3 |
ジャーナル | Electrochemistry |
巻 | 67 |
号 | 12 |
DOI | |
出版ステータス | Published - 1999 12月 |
ASJC Scopus subject areas
- 電気化学