Formation of Microprobe Using Nickel Electrodeposition

Yuko Sugai*, Fujio Asa, Yasuyuki Okada, Tokihiko Yokoshima, Toshiyuki Momma, Tetsuya Osaka, Tadatsugu Ito

*この研究の対応する著者

研究成果: Article査読

2 被引用数 (Scopus)

抄録

Formation of Ni microstructure with high aspect ratio without thicker photoresist was tried by an electrcdeposition method. The Ni microprobes thicker than photoresist thickness were electrodeposited on a patterned substrate using thin photoresist patterned with UV radiation. It was important for preparing Ni microprobe with high aspect ratio to keep the overpotential of patterned cathode higher, and moreover the agitation using a paddle plating cell system was so effective to form uniform microprobes.

本文言語English
ページ(範囲)1150-1152
ページ数3
ジャーナルElectrochemistry
67
12
DOI
出版ステータスPublished - 1999 12

ASJC Scopus subject areas

  • 電気化学

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