Fully adaptive thermal-aware routing for runtime thermal management of 3D network-on-chip

Xin Jiang, Xiangyang Lei, Lian Zeng, Takahiro Watanabe

研究成果: Conference contribution

1 引用 (Scopus)

抜粋

Thermal problem is an essential issue which must be taken Into account in the 3D Network-on-Chip NoC) design, because it has a great impact on not only the network performance, but also the reliability of the message transmission. Tn this work, we prescnt a fully adaptive runtime thermal-aware routing algorithm, which combines the distance, traffic state, path dhersity and the thermal impact in the path determination. By simultaneously considering all these factors, the routing algorithm can effectively balance the traffic load while keeping high adaptivity and routability, which also results in an even distribution of temperature across the network. Instead of collecting the topology information of the whole network, we utilize a 12 bits register to reserve the router state for one hop away, which saves the hardware cost largely and decreases the network latency. The simulation results show our proposed routing algorithm can improve the latency and energy consumption by comparing with other previously proposed thermal-aware routing schemes, and the improvement is more remarkable in large scale networks.

元の言語English
ホスト出版物のタイトルIMECS 2016 - International Multiconference of Engineers and Computer Scientists 2016
出版者Newswood Limited
ページ659-664
ページ数6
2
ISBN(電子版)9789881404763
出版物ステータスPublished - 2016
イベントInternational Multiconference of Engineers and Computer Scientists 2016, IMECS 2016 - Tsimshatsui, Kowloon, Hong Kong
継続期間: 2016 3 162016 3 18

Other

OtherInternational Multiconference of Engineers and Computer Scientists 2016, IMECS 2016
Hong Kong
Tsimshatsui, Kowloon
期間16/3/1616/3/18

ASJC Scopus subject areas

  • Computer Science (miscellaneous)

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  • これを引用

    Jiang, X., Lei, X., Zeng, L., & Watanabe, T. (2016). Fully adaptive thermal-aware routing for runtime thermal management of 3D network-on-chip. : IMECS 2016 - International Multiconference of Engineers and Computer Scientists 2016 (巻 2, pp. 659-664). Newswood Limited.