Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding

R. Yamamoto, K. Sueyoshi, K. Otsuka, T. Kasahara, A. Nakahara, Donghyun Yoon, Jun Mizuno, Tetsushi Sekiguchi, Shuichi Shoji

研究成果: Conference contribution

抄録

Au deposited SU-8 microdots comprised SU-8-PET microchip using low temperature polymer bonding technology is developed. A fine microdot array (1μm×1μm×0.5μm dots with 2μm pitch in area of 50μm×5mm) is fabricated by electron beam lithography (EBL) using SU-8 as a negative tone resist. A microchannel structure is formed with UV patterned SU-8 on a glass substrate. The SU-8 structure is sealed with a PET film by low temperature silane coupling bonding (140°C, 1.5MPa, 5min). The proposed microchip is fabricated successfully without leakage and is applicable as a microchip electrophoresis.

元の言語English
ホスト出版物のタイトル8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
ページ418-421
ページ数4
DOI
出版物ステータスPublished - 2013
イベント8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 - Suzhou
継続期間: 2013 4 72013 4 10

Other

Other8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
Suzhou
期間13/4/713/4/10

Fingerprint

Polymers
Microchip Electrophoresis
Silanes
Temperature
Electron beam lithography
Composite materials
Microchannels
Electrophoresis
Glass
Electrons
Technology
Substrates

ASJC Scopus subject areas

  • Biochemistry, Genetics and Molecular Biology (miscellaneous)
  • Biotechnology

これを引用

Yamamoto, R., Sueyoshi, K., Otsuka, K., Kasahara, T., Nakahara, A., Yoon, D., ... Shoji, S. (2013). Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding. : 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 (pp. 418-421). [6559762] https://doi.org/10.1109/NEMS.2013.6559762

Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding. / Yamamoto, R.; Sueyoshi, K.; Otsuka, K.; Kasahara, T.; Nakahara, A.; Yoon, Donghyun; Mizuno, Jun; Sekiguchi, Tetsushi; Shoji, Shuichi.

8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013. 2013. p. 418-421 6559762.

研究成果: Conference contribution

Yamamoto, R, Sueyoshi, K, Otsuka, K, Kasahara, T, Nakahara, A, Yoon, D, Mizuno, J, Sekiguchi, T & Shoji, S 2013, Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding. : 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013., 6559762, pp. 418-421, 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013, Suzhou, 13/4/7. https://doi.org/10.1109/NEMS.2013.6559762
Yamamoto R, Sueyoshi K, Otsuka K, Kasahara T, Nakahara A, Yoon D その他. Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding. : 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013. 2013. p. 418-421. 6559762 https://doi.org/10.1109/NEMS.2013.6559762
Yamamoto, R. ; Sueyoshi, K. ; Otsuka, K. ; Kasahara, T. ; Nakahara, A. ; Yoon, Donghyun ; Mizuno, Jun ; Sekiguchi, Tetsushi ; Shoji, Shuichi. / Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding. 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013. 2013. pp. 418-421
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abstract = "Au deposited SU-8 microdots comprised SU-8-PET microchip using low temperature polymer bonding technology is developed. A fine microdot array (1μm×1μm×0.5μm dots with 2μm pitch in area of 50μm×5mm) is fabricated by electron beam lithography (EBL) using SU-8 as a negative tone resist. A microchannel structure is formed with UV patterned SU-8 on a glass substrate. The SU-8 structure is sealed with a PET film by low temperature silane coupling bonding (140°C, 1.5MPa, 5min). The proposed microchip is fabricated successfully without leakage and is applicable as a microchip electrophoresis.",
keywords = "Au microdot array, dielectrophoresis, low temperature silane coupling bonding, microchip electrophoresis, SU-8 electron beam lithography",
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AU - Mizuno, Jun

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