Heatsink design using spiral-fins considering additive manufacturing

Shingo Otake, Yoshihiro Tateishi, Hiromichi Gohara, Ryoichi Kato, Yoshinari Ikeda, Victor Parque, Muhammed Khairi Faiz, Makoto Yoshida, Tomoyuki Miyashita

研究成果: Conference contribution

抜粋

In recent years, there have been increasing the number of power modules which is required with high performance, miniaturization and weight saving. But these requires cause high heat generation density for power module, which gets junction operation temperature to rise. Cooling unit is thus greatly demanded for high heat dissipation. The simple shaped heatsinks (straight-fin type and pin fin type) were generally used. But they have the limit of cooling performance. In this report, we have developed new heatsink shape to cope with rapidly increasing of the cooling requirement. Cooling performance is shown to thermal resistance and pressure loss. We evaluated them by thermal fluid analysis. In this approach, the spiral-fin heatsink with spiral curved channels has excellent cooling performance. This shape is the unique point in this report. This is because the shape with three-dimensional regular curve has not been studied. The spiral-fin heatsink has many factors (fin thickness, fin pitch, the number of channels, etc.). These factors affect cooler performance. We changed these factors to determine the best shape of spiral-fin. As a result, the best shape is 14.9[%] lower than the straight-fin type in thermal resistance.

元の言語English
ホスト出版物のタイトル2019 International Conference on Electronics Packaging, ICEP 2019
出版者Institute of Electrical and Electronics Engineers Inc.
ページ46-51
ページ数6
ISBN(電子版)9784990218867
DOI
出版物ステータスPublished - 2019 4
イベント2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
継続期間: 2019 4 172019 4 20

出版物シリーズ

名前2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
Japan
Niigata
期間19/4/1719/4/20

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

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  • これを引用

    Otake, S., Tateishi, Y., Gohara, H., Kato, R., Ikeda, Y., Parque, V., Faiz, M. K., Yoshida, M., & Miyashita, T. (2019). Heatsink design using spiral-fins considering additive manufacturing. : 2019 International Conference on Electronics Packaging, ICEP 2019 (pp. 46-51). [8733558] (2019 International Conference on Electronics Packaging, ICEP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2019.8733558