High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin

Takumi Kamibayashi, Hiroyuki Kuwae, Takahiro Kishioka, Yuki Usui, Takuya Ohashi, Mamoru Tamura, Shuichi Shoji, Jun Mizuno

研究成果: Conference contribution

1 引用 (Scopus)

抄録

We developed a fabrication method of high-aspect-ratio fine vias with a build-up resin. The build-up resin composed of a thermosetting resin and silica fillers has low coefficient of thermal expansion and low dielectric constant. Thermal imprint was performed to form the high-aspect-ratio fine via holes on the build-up resin. The imprint mold with high-aspect-ratio fine pillar patterns was fabricated by photolithography and deep reactive ion etching. The residual layer consisted of the thermosetting resin and the silica filler was removed by O 2 /CHF 3 plasma etching. The via of 1.2 μm in diameter with aspect ratio of 5.5, and 5.0 μm in pitch was successfully fabricated followed by Au electroplating. The proposed fabrication method is applicable for high-density 3-dimensional and 2.5-dimensional integration technologies.

元の言語English
ホスト出版物のタイトル13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
出版者IEEE Computer Society
ページ115-118
ページ数4
ISBN(電子版)9781538656150
DOI
出版物ステータスPublished - 2019 1 24
イベント13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan, Province of China
継続期間: 2018 10 242018 10 26

出版物シリーズ

名前Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2018-October
ISSN(印刷物)2150-5934
ISSN(電子版)2150-5942

Conference

Conference13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
Taiwan, Province of China
Taipei
期間18/10/2418/10/26

Fingerprint

Aspect ratio
Resins
Thermosets
Fillers
Silica
Fabrication
Plasma etching
Reactive ion etching
Electroplating
Photolithography
Thermal expansion
Permittivity
Hot Temperature

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

これを引用

Kamibayashi, T., Kuwae, H., Kishioka, T., Usui, Y., Ohashi, T., Tamura, M., ... Mizuno, J. (2019). High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin. : 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 (pp. 115-118). [8625825] (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 巻数 2018-October). IEEE Computer Society. https://doi.org/10.1109/IMPACT.2018.8625825

High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin. / Kamibayashi, Takumi; Kuwae, Hiroyuki; Kishioka, Takahiro; Usui, Yuki; Ohashi, Takuya; Tamura, Mamoru; Shoji, Shuichi; Mizuno, Jun.

13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, 2019. p. 115-118 8625825 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 巻 2018-October).

研究成果: Conference contribution

Kamibayashi, T, Kuwae, H, Kishioka, T, Usui, Y, Ohashi, T, Tamura, M, Shoji, S & Mizuno, J 2019, High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin. : 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018., 8625825, Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 巻. 2018-October, IEEE Computer Society, pp. 115-118, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018, Taipei, Taiwan, Province of China, 18/10/24. https://doi.org/10.1109/IMPACT.2018.8625825
Kamibayashi T, Kuwae H, Kishioka T, Usui Y, Ohashi T, Tamura M その他. High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin. : 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society. 2019. p. 115-118. 8625825. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2018.8625825
Kamibayashi, Takumi ; Kuwae, Hiroyuki ; Kishioka, Takahiro ; Usui, Yuki ; Ohashi, Takuya ; Tamura, Mamoru ; Shoji, Shuichi ; Mizuno, Jun. / High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin. 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, 2019. pp. 115-118 (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).
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