TY - GEN
T1 - High-aspect-ratio Sub-2-μm vias using thermal imprint with build-up resin
AU - Kamibayashi, Takumi
AU - Kuwae, Hiroyuki
AU - Kishioka, Takahiro
AU - Usui, Yuki
AU - Ohashi, Takuya
AU - Tamura, Mamoru
AU - Shoji, Shuichi
AU - Mizuno, Jun
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2019/1/24
Y1 - 2019/1/24
N2 - We developed a fabrication method of high-aspect-ratio fine vias with a build-up resin. The build-up resin composed of a thermosetting resin and silica fillers has low coefficient of thermal expansion and low dielectric constant. Thermal imprint was performed to form the high-aspect-ratio fine via holes on the build-up resin. The imprint mold with high-aspect-ratio fine pillar patterns was fabricated by photolithography and deep reactive ion etching. The residual layer consisted of the thermosetting resin and the silica filler was removed by O2/CHF3 plasma etching. The via of 1.2 μm in diameter with aspect ratio of 5.5, and 5.0 μm in pitch was successfully fabricated followed by Au electroplating. The proposed fabrication method is applicable for high-density 3-dimensional and 2.5-dimensional integration technologies.
AB - We developed a fabrication method of high-aspect-ratio fine vias with a build-up resin. The build-up resin composed of a thermosetting resin and silica fillers has low coefficient of thermal expansion and low dielectric constant. Thermal imprint was performed to form the high-aspect-ratio fine via holes on the build-up resin. The imprint mold with high-aspect-ratio fine pillar patterns was fabricated by photolithography and deep reactive ion etching. The residual layer consisted of the thermosetting resin and the silica filler was removed by O2/CHF3 plasma etching. The via of 1.2 μm in diameter with aspect ratio of 5.5, and 5.0 μm in pitch was successfully fabricated followed by Au electroplating. The proposed fabrication method is applicable for high-density 3-dimensional and 2.5-dimensional integration technologies.
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U2 - 10.1109/IMPACT.2018.8625825
DO - 10.1109/IMPACT.2018.8625825
M3 - Conference contribution
AN - SCOPUS:85062443848
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 115
EP - 118
BT - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
PB - IEEE Computer Society
T2 - 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
Y2 - 24 October 2018 through 26 October 2018
ER -