High perpendicular coercivity electroless cobalt alloy films with 25 nm thicknesses

T. Ouchi, Y. Arikawa, T. Kuno, T. Homma

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

This paper describes the development of Co alloy films thinner than 50 nm with high perpendicular magnetic coercivity using an electroless deposition process. In order to obtain these films, we used a Cu underlayer for a heteroepitaxial growth of the Co alloys and an optimized bath composition which included sodium hypophosphite and hydrazine as reductants. As a results, the perpendicular coercivity of the films turned to be higher 3000 Oe at the initial deposition stage with the thickness lower than 80 nm. In particular, the high perpendicular magnetic coercivity of the film as thin as 25 nm thick was obtained. These results indicate that electroless deposition is applicable for formation of the films with high perpendicular magnetic coercivity by optimizing the deposition conditions.

本文言語English
ホスト出版物のタイトルElectrodeposition of Nanoengineered Materials and Devices 3
ページ125-134
ページ数10
41
DOI
出版ステータスPublished - 2010 12 1
イベントElectrodeposition of Nanoengineered Materials and Devices 3 - 216th ECS Meeting - Vienna, Austria
継続期間: 2009 10 42009 10 9

出版物シリーズ

名前ECS Transactions
番号41
25
ISSN(印刷版)1938-5862
ISSN(電子版)1938-6737

Conference

ConferenceElectrodeposition of Nanoengineered Materials and Devices 3 - 216th ECS Meeting
CountryAustria
CityVienna
Period09/10/409/10/9

ASJC Scopus subject areas

  • Engineering(all)

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