抄録
The bonding characteristics of nickel nanoparticles as a new alternative bonding material for high-temperature soldering was considered and a high bonding strength was achieved at a bonding temperature of 300°C. It was also revealed in a bonding experiment using a silicon dummy chip with a deposited aluminum layer that direct bonding to an aluminum electrode was possible. On the other hand, a stress-relaxation structure using a metal film was presented as a new structure for resolving the problem of deteriorating bonding reliability due to thermal stress arising from differences in the coefficient of thermal expansion between the chip and the substrate. A silicon carbide device was assembled using the new bonding method and an operating test was performed to verify normal operation in a high-temperature environment of approximately 300°C.
本文言語 | English |
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ホスト出版物のタイトル | Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014 |
出版社 | IMAPS-International Microelectronics and Packaging Society |
ページ | 561-565 |
ページ数 | 5 |
ISBN(印刷版) | 9780990902805 |
出版ステータス | Published - 2014 |
イベント | 47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014 - San Diego, United States 継続期間: 2014 10月 13 → 2014 10月 16 |
Other
Other | 47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014 |
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国/地域 | United States |
City | San Diego |
Period | 14/10/13 → 14/10/16 |
ASJC Scopus subject areas
- 電子工学および電気工学