High-temperature-resistant interconnection using nickel nanoparticles

Yasunori Tanaka, Suguru Hashimoto, Tomonori Iizuka, Kohei Tatsumi, Norie Matsubara, Shinji Ishikawa, Masamoto Tanaka

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

The bonding characteristics of nickel nanoparticles as a new alternative bonding material for high-temperature soldering was considered and a high bonding strength was achieved at a bonding temperature of 300°C. It was also revealed in a bonding experiment using a silicon dummy chip with a deposited aluminum layer that direct bonding to an aluminum electrode was possible. On the other hand, a stress-relaxation structure using a metal film was presented as a new structure for resolving the problem of deteriorating bonding reliability due to thermal stress arising from differences in the coefficient of thermal expansion between the chip and the substrate. A silicon carbide device was assembled using the new bonding method and an operating test was performed to verify normal operation in a high-temperature environment of approximately 300°C.

本文言語English
ホスト出版物のタイトルProceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014
出版社IMAPS-International Microelectronics and Packaging Society
ページ561-565
ページ数5
ISBN(印刷版)9780990902805
出版ステータスPublished - 2014
イベント47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014 - San Diego, United States
継続期間: 2014 10月 132014 10月 16

Other

Other47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014
国/地域United States
CitySan Diego
Period14/10/1314/10/16

ASJC Scopus subject areas

  • 電子工学および電気工学

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