High temperature resistant packaging for SiC power devices using interconnections formed by Ni micro-electro-plating and Ni nano-particles
Yasunori Tanaka, Keito Ota, Haruka Miyano, Yoshiaki Shigenaga, Tomonori Iizuka, Kohei Tatsumi
研究成果: Conference contribution
2
被引用数
(Scopus)