High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding

Kohei Tatsumi, Isamu Morisako, Keiko Wada, Minoru Fukuomori, Tomonori Iizuka, Nobuaki Sato, Koji Shimizu, Kazutoshi Ueda, Masayuki Hikita, Rikiya Kamimura, Naoki Kawanabe, Kazuhiko Sugiura, Kazuhiro Tsuruta, Keiji Toda

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

New bonding technologies, which can deliver high-temperature thermal resistance that replaces solder bonding or Al wire bonding, have been strongly expected in order to maximize the performance of SiC power device. Aiming for application to the inverter system of HEV and EV, we have developed a new micro-plating interconnection technology named Nickel Micro Plating Bonding (NMPB), which enables the interconnection in a narrow space between electrodes and SiC devices via our newly designed lead frame, whose lead surface is formed into chevron shape. As for the bonding strength of NMPB, it was confirmed by shear tests that the bonds showed higher bonding strength than ordinary Pb free solder die bonding and no degradation even after HTS at 250°C for 1000hrs and after 1000cycle TCT(250°C/-45°C). The NMPB was applied to the manufacture of one leg SiC inverter power module using two pairs of SiC MOS-FETs and SBDs, which were interconnected with a newly designed lead frame for double sided cooling structure. After molding resin copper heat spreaders were formed on the outer surfaces of both sides of the NMPB leads by additive method. The module showed stable I-V characteristics at 250°C and lower switching loss. The reliability of the modules was confirmed by TCTs and power cycle tests.

本文言語English
ホスト出版物のタイトルProceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
出版社Institute of Electrical and Electronics Engineers Inc.
ページ1451-1456
ページ数6
ISBN(電子版)9781728114989
DOI
出版ステータスPublished - 2019 5
イベント69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States
継続期間: 2019 5 282019 5 31

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
2019-May
ISSN(印刷版)0569-5503

Conference

Conference69th IEEE Electronic Components and Technology Conference, ECTC 2019
CountryUnited States
CityLas Vegas
Period19/5/2819/5/31

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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