High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Toshikatsu Tanaka, Zengbin Wang, Tomonori Iizuka, Masahiro Kozako, Yoshimichi Ohki

研究成果: Conference article査読

4 被引用数 (Scopus)

抄録

Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.

本文言語English
論文番号6232750
ページ(範囲)691-694
ページ数4
ジャーナルAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
DOI
出版ステータスPublished - 2011 12 1
イベント2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011 - Cancun, Mexico
継続期間: 2011 10 162011 10 19

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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