TY - GEN
T1 - High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength
AU - Tanaka, Toshikatsu
AU - Wang, Zengbin
AU - Iizuka, Tomonori
AU - Kozako, Masahiro
AU - Ohki, Yoshimichi
PY - 2011/12/1
Y1 - 2011/12/1
N2 - Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m·K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.
AB - Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m·K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.
UR - http://www.scopus.com/inward/record.url?scp=84863280744&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84863280744&partnerID=8YFLogxK
U2 - 10.1109/ICPES.2011.6156695
DO - 10.1109/ICPES.2011.6156695
M3 - Conference contribution
AN - SCOPUS:84863280744
SN - 9781457715105
T3 - 2011 International Conference on Power and Energy Systems, ICPS 2011
BT - 2011 International Conference on Power and Energy Systems, ICPS 2011
T2 - 4th International Conference on Power and Energy Systems, ICPS 2011
Y2 - 22 December 2011 through 24 December 2011
ER -