High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Toshikatsu Tanaka*, Zengbin Wang, Tomonori Iizuka, Masahiro Kozako, Yoshimichi Ohki

*この研究の対応する著者

研究成果: Conference contribution

13 被引用数 (Scopus)

抄録

Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m·K and BD strength 15 kV peak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.

本文言語English
ホスト出版物のタイトル2011 International Conference on Power and Energy Systems, ICPS 2011
DOI
出版ステータスPublished - 2011 12月 1
イベント4th International Conference on Power and Energy Systems, ICPS 2011 - Chennai, India
継続期間: 2011 12月 222011 12月 24

出版物シリーズ

名前2011 International Conference on Power and Energy Systems, ICPS 2011

Conference

Conference4th International Conference on Power and Energy Systems, ICPS 2011
国/地域India
CityChennai
Period11/12/2211/12/24

ASJC Scopus subject areas

  • エネルギー工学および電力技術
  • 燃料技術

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