Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor

Akihiro Kojima, Yoshiaki Shimooka, Yoshiaki Sugizaki, Mitsuyoshi Endo, Hiroaki Yamazaki, Etsuji Ogawa, Tamio Ikehashi, Tatsuya Ohguro, Susumu Obata, Takeshi Miyagi, Ikuo Mori, Yoshiaki Toyoshima, Hideki Shibata

研究成果: Conference contribution

5 引用 (Scopus)

抜粋

In this paper, we report a thin-film encapsulation technology for wafer-level micro-electro-mechanical systems (MEMS) variable capacitor package. The electrical characteristics of MEMS are adversely affected by moisture. In order to prevent moisture from permeating into a package, the top surface was protected with a plasma-enhanced chemical vapor deposition (PE-CVD) SiN layer. The developed packages become a hybrid thin-film hermetic encapsulation consisting of an internal shell using PE-CVD SiO, a seal layer coating with resin, and an external protective layer formed by PE-CVD SiN. The process is fully compatible with standard low-cost back-end-of-the-line (BEOL) technologies for LSIs as a wafer-level package (WLP). This hybrid structure was very effective for protecting the MEMS device from external moisture. Moreover, the electrode surface area has to be wide, because a wide range of capacities is necessary in MEMS variable capacitors. We have developed a large (1480 × 1080 μm) hermetic thin-film encapsulation as WLP.

元の言語English
ホスト出版物のタイトルTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
ページ837-840
ページ数4
DOI
出版物ステータスPublished - 2009 12 11
イベントTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, United States
継続期間: 2009 6 212009 6 25

出版物シリーズ

名前TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

ConferenceTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
United States
Denver, CO
期間09/6/2109/6/25

    フィンガープリント

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

これを引用

Kojima, A., Shimooka, Y., Sugizaki, Y., Endo, M., Yamazaki, H., Ogawa, E., Ikehashi, T., Ohguro, T., Obata, S., Miyagi, T., Mori, I., Toyoshima, Y., & Shibata, H. (2009). Highly reliable and manufacturable in-line wafer-level hermetic packages for RF MEMS variable capacitor. : TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 837-840). [5285778] (TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2009.5285778