How different fillers affect the thermal conductivity of epoxy composites

I. A. Tsekmes, R. Kochetov, P. H F Morshuis, J. J. Smit, Tomonori Iizuka, Kohei Tatsumi, T. Tanaka

研究成果: Conference contribution

7 被引用数 (Scopus)

抄録

The low thermal conductivity of polymers can be improved with the incorporation of fillers with a relatively high thermal conductivity. However, the improvement which can be achieved depends not only on the filler properties but also on the interaction between the polymer matrix and fillers. In this study, a variety of polymer composites with surface modified particles were synthesized. Hexagonal boron nitride-, cubic boron nitride-and silica-epoxy composites were produced and their thermal conductivity was determined with the use of the transient plane source method. The results on the composite thermal conductivity suggest that the interaction between epoxy and fillers is one of the most important parameters. A better interaction results in the suppression of phonon scattering at the numerous interfaces and thus, in a higher composite thermal conductivity. Also, filler size can affect the performance of the polymer composites. The decrease of the filler size significantly increases the surface-to-volume ratio which in turn increases the phonon scattering at the interfaces. Finally, it seems that the intrinsic thermal conductivity of fillers slightly contributes to the thermal conductivity of composites especially when the filler size is smaller than 100 nm.

本文言語English
ホスト出版物のタイトル2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
出版社Institute of Electrical and Electronics Engineers Inc.
ページ647-650
ページ数4
ISBN(印刷版)9781479975235
DOI
出版ステータスPublished - 2014 12 22
イベント2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014 - Des Moines, United States
継続期間: 2014 10 192014 10 22

Other

Other2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
CountryUnited States
CityDes Moines
Period14/10/1914/10/22

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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