Hybrid Au-underfill resin bonding with lock-and-key structure

Masatsugu Nimura*, Akitsu Shigetou, Katsuyuki Sakuma, Hiroshi Ogino, Tomoyuki Enomoto, Jun Mizuno, Shuichi Shoji

*この研究の対応する著者

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

We developed a novel hybrid bonding technology for Au ultralow-profiled bumps and underfill resin with a modified "lock-and-key structure." The lock structure interlocks with the key structure. We applied these structures to perform an entire adhesion between the mating surfaces in place of conventional underfilling technique. To fabricate the key structure, we developed a simple process that can remove resin on the bumps. Lock structure was fabricated by photolithography and dry etching. After the bonding was carried out, the bonded interface was observed with a Scanning Electron Microscope (SEM), a transmission electron microscope (TEM) and a Scanning Acoustic Microscope (SAM). The results proved that no significant gap was existed at both Au-Au and resin-resin interface. Furthermore, the shear strength of the bonded sample with resin was ten times stronger than that without resin. The conduction of Au bump connections after hybrid bonding was also confirmed.

本文言語English
ホスト出版物のタイトル2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
ページ258-262
ページ数5
DOI
出版ステータスPublished - 2012 10 4
イベント2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 - San Diego, CA, United States
継続期間: 2012 5 292012 6 1

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Conference

Conference2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
国/地域United States
CitySan Diego, CA
Period12/5/2912/6/1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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