Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch

Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Mamoru Tamura, Tomoyuki Enomoto, Akitsu Shigetou

研究成果: Conference contribution

9 被引用数 (Scopus)

抄録

This paper describes hybrid bonding technology of Cu/Sn microbumps and adhesive with silica filler for three-dimensional (3D) interconnection of single-micron pitch. We fabricated bonding structure composed of 8-μm pitch Cu/Sn bumps and uncured adhesive with by using combination process of resin-chemical mechanical polishing (CMP) and O2/CHF3 plasma etching. Adhesive with silica filler is conventionally used for reduction of mechanical stress around microbumps by lowering CTE of underfill. With the bonding structure, the Cu/Sn microbumps and the adhesive were simultaneously bonded in N2 atmospheric pressure after surface treatment of Ar/H2 plasma irradiation. Results of scanning electron microscope (SEM) and scanning ion microscope (SIM) analyses show that Sn of microbumps was properly wetted on Cu film without resin and silica filler trapping. The adhesive was also bonded on Cu film in 6-μm gap between chips. The shear strength was 17.85 MPa. Therefore, proposed method is highly effective for hybrid bonding of single-micron pitch aimed at future ultra-high density 3D interconnection.

本文言語English
ホスト出版物のタイトル2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ページ325-330
ページ数6
ISBN(電子版)9781479986095
DOI
出版ステータスPublished - 2015 7 15
イベント2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
継続期間: 2015 5 262015 5 29

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
2015-July
ISSN(印刷版)0569-5503

Other

Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
国/地域United States
CitySan Diego
Period15/5/2615/5/29

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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