Hybrid integration of LiNbO 3 thin films on micromachined Si substrates using room-temperature transfer bonding

R. Takigawa, E. Higurashi, T. Suga, T. Kawanishi

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Hybrid integration of high-quality lithium niobate (LiNbO 3) single-crystal thin films (<5 μm) on micromachined Si substrates has been demonstrated using room-temperature flip-chip transfer bonding based on surface-activated bonding with Au microbumps.

本文言語English
ホスト出版物のタイトルProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
ページ数1
DOI
出版ステータスPublished - 2012 8 15
外部発表はい
イベント2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan
継続期間: 2012 5 222012 5 23

出版物シリーズ

名前Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Other

Other2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
CountryJapan
CityTokyo
Period12/5/2212/5/23

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Computer Vision and Pattern Recognition

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