IMC growth of solid state reaction between Ni UBM and Sn-3Ag-0.5Cu and Sn-3.5Ag solder bump using ball place bumping method during aging

Shinji Ishikawa, Eiji Hashino, Taro Kono, Kohei Tatsumi

研究成果: Article査読

19 被引用数 (Scopus)

フィンガープリント 「IMC growth of solid state reaction between Ni UBM and Sn-3Ag-0.5Cu and Sn-3.5Ag solder bump using ball place bumping method during aging」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

Chemical Compounds

Engineering & Materials Science

Physics & Astronomy