Impact of 0.10 μm SOI CMOS with body-tied hybrid trench isolation structure to break through the scaling crisis of silicon technology

Y. Hirano*, T. Matsumoto, S. Maeda, T. Iwamatsu, T. Kunikiyo, K. Nii, K. Yamamoto, Y. Yamaguchi, T. Ipposhi, S. Maegawa, M. Inuishi

*この研究の対応する著者

研究成果: Conference article査読

28 被引用数 (Scopus)

抄録

A hybrid-trench-isolation (HTI) technology is proposed to overcome the scaling limitations caused by the difficulty of gate thinning and increased soft error rate at the 0.1 μm era. It is revealed that a significant speed improvement against bulk is achieved by using the body-tied structure without floating-body-related speed deterioration. A two-order reduction in the soft error rate for an HTI-SOI 4M-bit SRAM was demonstrated as compared with bulk one. Moreover, it is presented that full trench isolation in the HTI offers excellent isolation characteristics to realize the one-chip integration of analog and digital LSI's. It is concluded that SOI technology with the HTI structure is one of the solutions against the scaling limitations.

本文言語English
ページ(範囲)467-470
ページ数4
ジャーナルTechnical Digest - International Electron Devices Meeting
出版ステータスPublished - 2000 12月 1
外部発表はい
イベント2000 IEEE International Electron Devices Meeting - San Francisco, CA, United States
継続期間: 2000 12月 102000 12月 13

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 電子工学および電気工学
  • 材料化学

フィンガープリント

「Impact of 0.10 μm SOI CMOS with body-tied hybrid trench isolation structure to break through the scaling crisis of silicon technology」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル