Impact of 0.10 μm SOI CMOS with body-tied hybrid trench isolation structure to break through the scaling crisis of silicon technology
Y. Hirano*, T. Matsumoto, S. Maeda, T. Iwamatsu, T. Kunikiyo, K. Nii, K. Yamamoto, Y. Yamaguchi, T. Ipposhi, S. Maegawa, M. Inuishi
*この研究の対応する著者
研究成果: Conference article › 査読
28
被引用数
(Scopus)