We clarify the effects of the strained-SiO2 on the time dependent dielectric breakdown (TDDB) characteristics, the activation energy of the oxide breakdown and Weibull slope (β) for the ultra-thin gate oxide. Considerations based on the extended-Stillinger-Weber potential model show that the built-in compressive strain in SiO2 changes the statistical distribution of the Si-O-Si angle, leading to a decrease of Tbd and a spread of the distribution. The oxide breakdown tends to occur at the Si-O-Si network with a lower bond angle (approximately 115°) for the 2 nm-thick SiO2/Si system.
|ジャーナル||Digest of Technical Papers - Symposium on VLSI Technology|
|出版物ステータス||Published - 2000 1 1|
|イベント||2000 Symposium on VLSI Technology - Honolulu, HI, USA|
継続期間: 2000 6 13 → 2000 6 15
ASJC Scopus subject areas
- Electrical and Electronic Engineering