Improved delay-matching bus routing by using multi-layers

Yang Tian, Takahiro Watanabe

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Recently, signal propagation delay in VLSI or PCB becomes a very critical problem due to the increasing clock frequency, where signal delay should be adjusted to meet the requirement of the delay time. The delay can be roughly estimated by the net length. While, due to the circuit complexity and the high density of integration, a single layer routing may not be enough for delay estimation. In recent research, there's a highly efficient algorithm for length matching bus routing for signal delay. However, it doesn't put the high density of integration into consideration. The purpose of this paper is to route several nets by using multiple layers on a high density board to meet the signal delay requirement, even if there exist obstacles in the routing area. Previous research put focus on the single layer routing without considering the complexity and density of the board. In this paper, the complexity and density are taken into account. In our proposed algorithm, the routing area is divided into subareas to solve the problem efficiently, some searching vertices will be set in advance and nets can be assigned to the proper layers to avoid obstacles. After the net assignment, path generation is executed. Then, some optimizations are made to meet the signal delay for each net. Finally, the routing paths of nets which satisfy the delay constraint are determined. Experimental results show that our proposed method is highly effective and efficient.

本文言語English
ホスト出版物のタイトルICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
出版社Institute of Electrical and Electronics Engineers Inc.
ページ708-713
ページ数6
ISBN(印刷版)9784904090138
DOI
出版ステータスPublished - 2015 5月 20
イベント2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
継続期間: 2015 4月 142015 4月 17

Other

Other2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
国/地域Japan
CityKyoto
Period15/4/1415/4/17

ASJC Scopus subject areas

  • 電子工学および電気工学

フィンガープリント

「Improved delay-matching bus routing by using multi-layers」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル