Improved low temperature gold-gold bonding using nanoporous powder bump using vacuum ultraviolet irradiation pre-treatment

Tatsushi Kaneda, Jun Mizuno, Akiko Okada, Kaori Matsunaga, Shuichi Shoji, Mikiko Saito, Hiroshi Nishikawa

研究成果

2 被引用数 (Scopus)

抄録

This paper describes a novel low temperature Au-Au bonding method using nanoporous Au-Ag powder and vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O<inf>3</inf>) pre-treatment. The nanoporous powder, which was fabricated by dealloying Ag-Au alloy sheet, was used to form the bump structure on the Au substrate by simple filing process, while an Au-coated Si substrate was used as the chip. The VUV/O<inf>3</inf> treated bumps and chip was bonded under a bonding pressure of 20 MPa at 200 °C for 20 min in a vacuum atmosphere of 1 kPa. A ligament size of the nanoporous structure on powder surface was found to be grown dramatically during bonding process. The tensile strength reached 10.1 MPa which is 2.3 times higher than that without VUV/O<inf>3</inf> treatment. This suggests that organic contaminants on the each ligament surface were effectively removed by VUV/O<inf>3</inf> treatment, and consequently, the diffusion of gold atoms in the nanoporous powder was significantly promoted to change into bulk structure. The proposed method will be highly a promising method for 3D-LSI and MEMS packaging.

本文言語English
ホスト出版物のタイトルICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
出版社Institute of Electrical and Electronics Engineers Inc.
ページ473-477
ページ数5
ISBN(印刷版)9784904090138
DOI
出版ステータスPublished - 2015 5 20
イベント2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
継続期間: 2015 4 142015 4 17

Other

Other2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
国/地域Japan
CityKyoto
Period15/4/1415/4/17

ASJC Scopus subject areas

  • 電子工学および電気工学

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