抄録
Bond degradation of Au wire/Al pad has become a major problem, because of the use of molding resin with low thermal stability (ex. bi-phenyl epoxy resin) and the use of the IC devices under high thermal environments. It is therefore important to secure the Au/Al bond reliability under high temperatures. The lifetime to bond failure for bi-phenyl epoxy molding became shorter than that for cresol novolac epoxy. The failures were caused by the corrosion reaction of Au-Al intermetallics with bromine(Br) contained in the resin compounds. It was clarified that the reactive intermetallic was Au4Al phase formed in the bond interface. The governing factors of the bond corrosion were investigated such as resin compound, gold wire material. Especially impurities in gold wire could affect the Au-Al intermetallic growing and therefore retard the corrosion. The use of the alloyed wire was effective in improving the bond reliability.
| 本文言語 | English |
|---|---|
| ページ（範囲） | 591-596 |
| ページ数 | 6 |
| ジャーナル | Proceedings of SPIE - The International Society for Optical Engineering |
| 巻 | 3582 |
| 出版ステータス | Published - 1998 12月 1 |
| 外部発表 | はい |
| イベント | Proceedings of the 1998 International Symposium on Microelectronics - San Diego, CA, USA 継続期間: 1998 11月 1 → 1998 11月 4 |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 凝縮系物理学
- コンピュータ サイエンスの応用
- 応用数学
- 電子工学および電気工学