Improvement of thermal fatigue properties of Sn-Ag-Cu lead-free solder interconnects on casio's wafer-level packages based on morphology and grain boundary character

S. Terashima*, T. Kohno, A. Mizusawa, K. Arai, O. Okada, T. Wakabayashi, M. Tanaka, K. Tatsumi

*この研究の対応する著者

研究成果査読

30 被引用数 (Scopus)

抄録

Thermal fatigue properties of commercial LF35 (Sn-1.2Ag-0.5Cu-0.05Ni), SAC105 (Sn-1Ag-0.5Cu), and SAC305 (Sn-3Ag-0.5Cu) solders on Casio's wafer-level packages are discussed from the viewpoints of both morphology and grain boundary character. Orientation imaging microscopy revealed that both LF35 and SAC305 resisted the coarsening of tin grains during thermal fatigue as compared with SAC105, correlating with their greater fraction of coincidence site lattice boundaries. This seems to explain why LF35 has superior thermal fatigue life in spite of its lower silver content.

本文言語English
ページ(範囲)33-38
ページ数6
ジャーナルJournal of Electronic Materials
38
1
DOI
出版ステータスPublished - 2009 1
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 電子工学および電気工学
  • 材料化学

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