The stress of the electrodeposited pure Sn and the Ni-62 atom % Sn alloy thin film electrodes during cycling was measured in situ using an optical cantilever method. The results revealed that the Ni-62 atom % Sn alloy electrode with better cycle endurance actually experiences larger stress compared to the pure Sn electrode. Furthermore, the stress-release phenomenon during the open-circuit period has been confirmed for the first time. This paper demonstrates that the cantilever bending method is effective for the in situ study of the stress development, transition, and hence the phenomena taking place within the Sn-based electrodes.
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