Integrated DFB Laser Diode and High-efficiency Mach-Zehnder Modulator using Membrane III-V Semiconductors on Si Photonics Platform

T. Hiraki, T. Aihara, T. Fujii, K. Takeda, T. Kakitsuka, T. Tsuchizawa, S. Matsuo

研究成果: Conference contribution

抜粋

We have demonstrated heterogeneous integration of a distributed feedback laser diode (LD) and high-efficiency InGaAsP Mach-Zehnder modulator (MZM) on Si waveguide circuits. Epitaxial regrowth on directly bonded III-V layer is a key to integrate III-V active materials with different bandgaps on Si. The integrated device shows a LD threshold current of 4.5 mA with a 500-μm active length, VπL of 0.4 Vcm with a 500-μm long phase shifter, and fiber coupled output power of 2.9 mW with an LD current of 70 mA. The device also shows an eye opening at 28 Gbit/s with 4.2 Vpp.

元の言語English
ホスト出版物のタイトル2019 IEEE International Electron Devices Meeting, IEDM 2019
出版者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781728140315
DOI
出版物ステータスPublished - 2019 12
外部発表Yes
イベント65th Annual IEEE International Electron Devices Meeting, IEDM 2019 - San Francisco, United States
継続期間: 2019 12 72019 12 11

出版物シリーズ

名前Technical Digest - International Electron Devices Meeting, IEDM
2019-December
ISSN(印刷物)0163-1918

Conference

Conference65th Annual IEEE International Electron Devices Meeting, IEDM 2019
United States
San Francisco
期間19/12/719/12/11

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

フィンガープリント Integrated DFB Laser Diode and High-efficiency Mach-Zehnder Modulator using Membrane III-V Semiconductors on Si Photonics Platform' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Hiraki, T., Aihara, T., Fujii, T., Takeda, K., Kakitsuka, T., Tsuchizawa, T., & Matsuo, S. (2019). Integrated DFB Laser Diode and High-efficiency Mach-Zehnder Modulator using Membrane III-V Semiconductors on Si Photonics Platform. : 2019 IEEE International Electron Devices Meeting, IEDM 2019 [8993518] (Technical Digest - International Electron Devices Meeting, IEDM; 巻数 2019-December). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEDM19573.2019.8993518