Interconnection of multi-pad array was developed by using the electroless CAEx deposition of NiB for application to the new flipchip bonding technology. Behavior of CAEx deposition of Electroless NiB films was depended on pad width and distance between facing pads, and pad with nearer distance and wider pad size was achieved. Practical feasibility of this technique was demonstrated by forming interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.
|ホスト出版物のタイトル||ECS Transactions - Electrodeposition of Nanoengineered Materials and Alloys 2|
|出版物ステータス||Published - 2008 12 24|
|イベント||Electrodeposition of Nanoengineered Materials and Alloys 2 - 212th ECS Meeting - Washington, DC, United States|
継続期間: 2007 10 7 → 2007 10 12
|Conference||Electrodeposition of Nanoengineered Materials and Alloys 2 - 212th ECS Meeting|
|期間||07/10/7 → 07/10/12|
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