Interconnection of multi-pad electrodes by "controlled anisotropic extraneous (CAEx) deposition" of electroless NiB film

T. Yokoshima, Y. Yamaji, N. Igawa, Y. Tamura, K. Kikuchi, H. Nakagawa, M. Aoyagi

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

Interconnection of multi-pad array was developed by using the electroless CAEx deposition of NiB for application to the new flipchip bonding technology. Behavior of CAEx deposition of Electroless NiB films was depended on pad width and distance between facing pads, and pad with nearer distance and wider pad size was achieved. Practical feasibility of this technique was demonstrated by forming interconnection between pads separated by 5 μm and measuring 5 μm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 μm.

本文言語English
ホスト出版物のタイトルECS Transactions - Electrodeposition of Nanoengineered Materials and Alloys 2
ページ65-74
ページ数10
28
DOI
出版ステータスPublished - 2008 12 24
外部発表はい
イベントElectrodeposition of Nanoengineered Materials and Alloys 2 - 212th ECS Meeting - Washington, DC, United States
継続期間: 2007 10 72007 10 12

出版物シリーズ

名前ECS Transactions
番号28
11
ISSN(印刷版)1938-5862
ISSN(電子版)1938-6737

Conference

ConferenceElectrodeposition of Nanoengineered Materials and Alloys 2 - 212th ECS Meeting
CountryUnited States
CityWashington, DC
Period07/10/707/10/12

ASJC Scopus subject areas

  • Engineering(all)

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