We prepared six kinds of epoxy resin nanocomposites with silica and an epoxy resin with no silica. The nanocomposites contain silica with different diameters (10, 50, and 100 nm) while their silica contents are 1, 5, 10, and 20 vol%. At 25 and 100 °C, the thermal conductivity has a nearly proportional dependence on the silica content and exhibits an almost reciprocal proportionality to the diameter of the silica. The latter result indicates that the interaction at filler-resin interfaces plays a significant role in heat transfer. However, this view contradicts an easy-to-understand thought that the filler-resin interfaces should work as a barrier for heat transfer. This in turn indicates that the interaction at filler-resin interfaces controls the bulk properties of the resin when the filler is in a nm size. Although the dielectric constant increases with the addition of the silica filler, its increment from the resin with no silica is the smallest in the resin with the 10-nm silica. Therefore, the addition of the 10-nm silica is adequate for electrical insulation purposes.
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