Investigation of shear stress between roll interfaces in a high-accuracy roll-type stamping transfer system

Makoto Tokonami, Shunsuke Yamada, Makoto Kashiwagi, Eiji Iwase

研究成果: Article査読

抄録

We investigated the influence of the shear force on a roll-type transfer technique developed to realize high transfer ratio and high positioning accuracy. Roll-type stamping transfer is a promising method for integrating solid-state devices on flexible substrates. However, the accuracy of the roll-type stamping transfer method is insufficient for tiny devices, such as Micro-Electro-Mechanical-Systems (MEMS) sensors, integrated circuits, and surface-mounting chips, because of the shear stress that occurs at the contact of the two rolls. In this work, the shear force was measured at various roll radii and rotational speeds. The results suggest that adjustments of the roll radius can reduce the shear stress to less than 10 kPa. The low shear stress improves the misalignment angle by 2 degrees, with a high roll rotational speed, which enables the development of a hybrid sensing system for flexible and rigid devices at a large-scale.

本文言語English
ページ(範囲)79-83
ページ数5
ジャーナルieej transactions on sensors and micromachines
140
4
DOI
出版ステータスPublished - 2020

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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