Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products

Hongbin Shi, Toshitsugu Ueda

    研究成果: Conference contribution

    12 引用 (Scopus)

    抄録

    This paper discusses the influences of various underfills and adhesives on board-level bend performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the monotonic three-point bending test. It is found that the bonding materials do enhance the bend performance for all the test categories as compared with the control assemblies which are without bonding materials, but the degrees of improvements between different strategies vary quiet a lot. The specific bend strength is affected by a number of factors, in which dispending patterns and properties of the bonding materials used influence it obviously. In general, the partial capillary flow underfill and edge bond adhesive with relatively lower storage modulus and higher apparent strengths of adhesion (ASA) are preferred. In order to further understand the failure mechanism of the CTBGA during the bending test, failure analysis on tested devices are also conducted using dye-and-pry and cross-section, the results indicate that the dominant failure mode is PCB pad cratering, regardless with or without bonding materials.

    元の言語English
    ホスト出版物のタイトルICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
    ページ91-96
    ページ数6
    DOI
    出版物ステータスPublished - 2011
    イベント2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai
    継続期間: 2011 8 82011 8 11

    Other

    Other2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
    Shanghai
    期間11/8/811/8/11

    Fingerprint

    Ball grid arrays
    Adhesives
    Lead
    Bending tests
    Capillary flow
    Polychlorinated biphenyls
    Failure modes
    Failure analysis
    Adhesion
    Dyes
    Elastic moduli

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    これを引用

    Shi, H., & Ueda, T. (2011). Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products. : ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging (pp. 91-96). [6066797] https://doi.org/10.1109/ICEPT.2011.6066797

    Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products. / Shi, Hongbin; Ueda, Toshitsugu.

    ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 91-96 6066797.

    研究成果: Conference contribution

    Shi, H & Ueda, T 2011, Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products. : ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging., 6066797, pp. 91-96, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 11/8/8. https://doi.org/10.1109/ICEPT.2011.6066797
    Shi H, Ueda T. Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products. : ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 91-96. 6066797 https://doi.org/10.1109/ICEPT.2011.6066797
    Shi, Hongbin ; Ueda, Toshitsugu. / Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. pp. 91-96
    @inproceedings{9d8a76ab5ece4f80b5cf99c73973ee12,
    title = "Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products",
    abstract = "This paper discusses the influences of various underfills and adhesives on board-level bend performance of ChipArray{\circledR} Thin Core Ball Grid Array (CTBGA) assemblies through an the monotonic three-point bending test. It is found that the bonding materials do enhance the bend performance for all the test categories as compared with the control assemblies which are without bonding materials, but the degrees of improvements between different strategies vary quiet a lot. The specific bend strength is affected by a number of factors, in which dispending patterns and properties of the bonding materials used influence it obviously. In general, the partial capillary flow underfill and edge bond adhesive with relatively lower storage modulus and higher apparent strengths of adhesion (ASA) are preferred. In order to further understand the failure mechanism of the CTBGA during the bending test, failure analysis on tested devices are also conducted using dye-and-pry and cross-section, the results indicate that the dominant failure mode is PCB pad cratering, regardless with or without bonding materials.",
    author = "Hongbin Shi and Toshitsugu Ueda",
    year = "2011",
    doi = "10.1109/ICEPT.2011.6066797",
    language = "English",
    isbn = "9781457717680",
    pages = "91--96",
    booktitle = "ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging",

    }

    TY - GEN

    T1 - Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products

    AU - Shi, Hongbin

    AU - Ueda, Toshitsugu

    PY - 2011

    Y1 - 2011

    N2 - This paper discusses the influences of various underfills and adhesives on board-level bend performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the monotonic three-point bending test. It is found that the bonding materials do enhance the bend performance for all the test categories as compared with the control assemblies which are without bonding materials, but the degrees of improvements between different strategies vary quiet a lot. The specific bend strength is affected by a number of factors, in which dispending patterns and properties of the bonding materials used influence it obviously. In general, the partial capillary flow underfill and edge bond adhesive with relatively lower storage modulus and higher apparent strengths of adhesion (ASA) are preferred. In order to further understand the failure mechanism of the CTBGA during the bending test, failure analysis on tested devices are also conducted using dye-and-pry and cross-section, the results indicate that the dominant failure mode is PCB pad cratering, regardless with or without bonding materials.

    AB - This paper discusses the influences of various underfills and adhesives on board-level bend performance of ChipArray® Thin Core Ball Grid Array (CTBGA) assemblies through an the monotonic three-point bending test. It is found that the bonding materials do enhance the bend performance for all the test categories as compared with the control assemblies which are without bonding materials, but the degrees of improvements between different strategies vary quiet a lot. The specific bend strength is affected by a number of factors, in which dispending patterns and properties of the bonding materials used influence it obviously. In general, the partial capillary flow underfill and edge bond adhesive with relatively lower storage modulus and higher apparent strengths of adhesion (ASA) are preferred. In order to further understand the failure mechanism of the CTBGA during the bending test, failure analysis on tested devices are also conducted using dye-and-pry and cross-section, the results indicate that the dominant failure mode is PCB pad cratering, regardless with or without bonding materials.

    UR - http://www.scopus.com/inward/record.url?scp=81355132199&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=81355132199&partnerID=8YFLogxK

    U2 - 10.1109/ICEPT.2011.6066797

    DO - 10.1109/ICEPT.2011.6066797

    M3 - Conference contribution

    AN - SCOPUS:81355132199

    SN - 9781457717680

    SP - 91

    EP - 96

    BT - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

    ER -