Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment

N. Unami, H. Noma, K. Sakuma, A. Shigetou, S. Shoji, J. Mizuno

研究成果: Conference contribution

3 引用 (Scopus)

抜粋

We studied the effects of surface treatment using vacuum ultraviolet (VUV) and formic acid vapor for SnCu-Au flip-chip bonding. Sn-rich solder bumps are widely used for flip-chip interconnections because of low melting temperature and high mechanical strength. For fine pitch interconnections, surface modification is needed before the bonding process. X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES) were used to investigate Sn surfaces. The results showed how the VUV/O 3 surface treatment removes the carbon-based organic contaminants from the Sn surfaces and the formic acid treatment reduces the metal oxides of Sn. Combination of VUV/O 3 and formic acid treatments improved shear strength of a bonded sample. The average shear strength of each bump with VUV/O 3 and/or formic acid treatment is about twice that of a bump with no treatment.

元の言語English
ホスト出版物のタイトルAPM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials
ページ220-225
ページ数6
DOI
出版物ステータスPublished - 2011 12 1
イベント2011 International Symposium on Advanced Packaging Materials, APM 2011 - Xiamen, China
継続期間: 2011 10 252011 10 28

出版物シリーズ

名前Proceedings - International Symposium on Advanced Packaging Materials
ISSN(印刷物)1550-5723

Conference

Conference2011 International Symposium on Advanced Packaging Materials, APM 2011
China
Xiamen
期間11/10/2511/10/28

    フィンガープリント

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Materials Science(all)

これを引用

Unami, N., Noma, H., Sakuma, K., Shigetou, A., Shoji, S., & Mizuno, J. (2011). Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment. : APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials (pp. 220-225). [6105704] (Proceedings - International Symposium on Advanced Packaging Materials). https://doi.org/10.1109/ISAPM.2011.6105704