Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application

Jianfeng Yan*, Guisheng Zou, Xiaoyu Wang, Hailin Bai, Fengwen Mu, Aiping Wu

*この研究の対応する著者

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

Lead is a toxic element which usually brings harm to natural resources and human health. The use of Pb-containing solder alloys are forbidden to be employed in electronic packaging, which led to the great efforts to the investigation and implementation of lead-free bonding materials. The novel low temperature sintering bonding using metal nanoparticles is a promising technique for lead free bonding method used in electronic packaging industry. In this article, a large scale chemical reduction method to synthesize silver nanoparticles (Ag NPs) for this low temperature bonding application was put forward. The obtained Ag NPs were confirmed by XRD to be crystalline silver with a face-centered cubic (fee) structure. We observed monodisperse spherical Ag NPs with a diameter range of 35 ± 15 nm. The influence of reaction parameters on the resulting particle size and its distribution is investigated. Robust joints were formed using the Ag NPs as the bonding materials at the low bonding temperature. The shear strengths of joints reach about 49.93 MPa at low temperature of 250 °C. The results show that the Ag NPs synthesized by this large scale chemical reduction method are suitable to be used as low temperature lead bonding material in electronic packaging industry.

本文言語English
ホスト出版物のタイトルICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
ページ254-259
ページ数6
DOI
出版ステータスPublished - 2011 11月 22
外部発表はい
イベント2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai, China
継続期間: 2011 8月 82011 8月 11

出版物シリーズ

名前ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Conference

Conference2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
国/地域China
CityShanghai
Period11/8/811/8/11

ASJC Scopus subject areas

  • 電子工学および電気工学

フィンガープリント

「Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル