Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability

Shinji Ishikawa*, Tomoyuki Uchiyama, Eiji Hashino, Taro Kohno, Masamoto Tanaka, Kohei Tatsumi

*この研究の対応する著者

研究成果: Conference contribution

6 被引用数 (Scopus)

抄録

Micro-ball wafer bumping (MBB) technology, which has capability of fine pitch bumping such as 150-μm pad pitch and the advantages of adjusting the optimum material combinations of joints, was brought into practice. High productivity and yield were achieved by employing an inspection and the repair process with special equipment, and a void-less reflow process was established. Package-level reliability tests were performed for chips with Ti/NiV/CuUBM and Sn-Ag-Cu solder bumps using MBB technology with excellent results. An evaluation on reliability was also conducted with Sn-1.2Ag-0.5Cu-Ni solder and pure tin solder bumps. As a result of multiple reflow cycle tests for Ti/NiV/Cu-UBM and various lead-free solders, the shape of IMC and the spalling of IMC were influenced by the total amount of Cu and Ni in the solder and the UBM composition. Ti/NiV/Cu-UBM can be applied to various solders by changing the thickness of the surface Cu layer according to the composition of the solder.

本文言語English
ホスト出版物のタイトルProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
ページ872-877
ページ数6
DOI
出版ステータスPublished - 2007
外部発表はい
イベント57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
継続期間: 2007 5月 292007 6月 1

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Conference

Conference57th Electronic Components and Technology Conference 2007, ECTC '07
国/地域United States
CitySparks, NV
Period07/5/2907/6/1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

フィンガープリント

「Lead-free solder micro-ball bumps for the next generation of flip chip interconnection: Micro-ball materials, bump formation process and reliability」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル