Leakage-aware performance-driven TSV-planning based on network flow algorithm in 3D ICs

Kan Wang, Sheqin Dong, Yuchun Ma, Goto Satoshi, Jason Cong

    研究成果: Conference contribution

    2 引用 (Scopus)

    抜粋

    3D IC has become an attractive technology as it decreases interconnection distance and improves performance. However, it is faced with heat dissipation and temperature problem seriously. The high temperature will increase the interconnection delay, and lead to degradation of performance. Through-silicon-via (TSV) has been shown as an effective way to optimize heat distribution. However, the distribution of TSVs will potentially influence the interconnection delay. In this paper, we propose a performance-driven 3D TSV-planning (3D-PTSP) algorithm, which can generate good TSV distribution, to improve temperature. The thermal effects on critical path delay are analyzed with leakage power-temperature-delay dependence considered. A priority based TSV redistribution algorithm and network flow based signal via allocation algorithm help to improve both TSV number and critical path delay without increasing temperature. Experimental results show that the proposed method can improve total via number by 8.9% and reduce critical path delay by 15.8%.

    元の言語English
    ホスト出版物のタイトルProceedings - International Symposium on Quality Electronic Design, ISQED
    ページ129-136
    ページ数8
    DOI
    出版物ステータスPublished - 2012
    イベント13th International Symposium on Quality Electronic Design, ISQED 2012 - Santa Clara, CA
    継続期間: 2012 3 192012 3 21

    Other

    Other13th International Symposium on Quality Electronic Design, ISQED 2012
    Santa Clara, CA
    期間12/3/1912/3/21

      フィンガープリント

    ASJC Scopus subject areas

    • Hardware and Architecture
    • Electrical and Electronic Engineering
    • Safety, Risk, Reliability and Quality

    これを引用

    Wang, K., Dong, S., Ma, Y., Satoshi, G., & Cong, J. (2012). Leakage-aware performance-driven TSV-planning based on network flow algorithm in 3D ICs. : Proceedings - International Symposium on Quality Electronic Design, ISQED (pp. 129-136). [6187485] https://doi.org/10.1109/ISQED.2012.6187485