Linear Programming Bounds for Multi-level Unequal Protection Codes

Tomohiko Saito, Toshiyasu Matsushima, Shigeichi Hirasawa

研究成果: Conference contribution

抜粋

In coding theory, it is important to find upper bounds for the code size given a code length and minimum distance. The Hamming bounds and Linear Programming (LP) bounds were proposed in previous works. On the other hand, Masnick et al. proposed Unequal Error Protection (UEP) codes and modified Hamming bounds as upper bounds for the code size of UEP codes. In our previous work, we defined 2-level UEP codes as a subclass of UEP codes, and derived LP bounds for 2-level UEP codes. In this paper, we define multi-level UEP codes by extending 2-level UEP codes, and derive LP bounds for multi-level UEP codes. Moreover, we show that LP bounds for UEP codes are tighter upper bound than modified Hamming bounds.

元の言語English
ホスト出版物のタイトルProceedings - 2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018
出版者Institute of Electrical and Electronics Engineers Inc.
ページ2917-2922
ページ数6
ISBN(電子版)9781538666500
DOI
出版物ステータスPublished - 2019 1 16
イベント2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018 - Miyazaki, Japan
継続期間: 2018 10 72018 10 10

出版物シリーズ

名前Proceedings - 2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018

Conference

Conference2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018
Japan
Miyazaki
期間18/10/718/10/10

ASJC Scopus subject areas

  • Information Systems
  • Information Systems and Management
  • Health Informatics
  • Artificial Intelligence
  • Computer Networks and Communications
  • Human-Computer Interaction

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  • これを引用

    Saito, T., Matsushima, T., & Hirasawa, S. (2019). Linear Programming Bounds for Multi-level Unequal Protection Codes. : Proceedings - 2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018 (pp. 2917-2922). [8616492] (Proceedings - 2018 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SMC.2018.00496