Low-cost and reliable packaging technology for stacked MCP with MEMS and control IC chips

Mitsuyoshi Endo*, Akihiro Kojima, Yoshiaki Shimooka, Yoshiaki Sugizaki, Hiroaki Yamazaki, Etsuji Ogawa, Tamio Ikehashi, Tatsuya Ohguro, Susumu Obata, Yusaku Asano, Takeshi Miyagi, Ikuo Mori, Yoshiaki Toyoshima, Hideki Shibata

*この研究の対応する著者

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

This paper reports a wafer-level package (WLP) encapsulation and a stacked multi-chip package (MCP) for electrostatically actuated MEMS variable capacitor and control IC chips. Since the MEMS capacitor needs to be operated in dry atmosphere, we developed the WLP encapsulation structure with four thin-film layers fabricated by conventional back-end-of-the-line (BEOL) LSI technologies. Furthermore, since a MEMS chip is actuated by a control IC chip that provides high voltage, we developed the stacked MCP to integrate the MEMS chip and the control IC chip. In order to handle relatively fragile WLP encapsulation, the stacked MCP process was optimized. The stacked MCP has 4.5×4.5mm size and 0.8mm thickness, which is the thinnest package for stacked MEMS and IC chips. Normal operation of the MEMS variable capacitor in the stacked MCP confirmed up to 85%RH after reliability tests, i.e. temperature cycling, accelerated moisture resistance, and moisture/reflow sensitivity.

本文言語English
ホスト出版物のタイトルProceedings - 2009 International Symposium on Microelectronics, IMAPS 2009
ページ166-173
ページ数8
出版ステータスPublished - 2009 12月 1
外部発表はい
イベント42nd International Symposium on Microelectronics, IMAPS 2009 - San Jose, CA, United States
継続期間: 2009 11月 12009 11月 5

出版物シリーズ

名前Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009

Conference

Conference42nd International Symposium on Microelectronics, IMAPS 2009
国/地域United States
CitySan Jose, CA
Period09/11/109/11/5

ASJC Scopus subject areas

  • 電子工学および電気工学

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