Low temperature and low pressure bump bonding realized by single-micrometer Ag-nanoparticle bumps

Weixin Fu, Takashi Kasahara, Akiko Okada, Shuichi Shoji, Akitsu Shigetou, Jun Mizuno

研究成果

抄録

A bonding method using single-micrometer bumps, which were formed by Ag nanoparticle, had been realized under low bonding temperature and low compressive stress. The bump diameter is 8 μm and the pitch is 16 μm. The bonding temperature was 250 °C under compressive stress of about 41.4 MPa. A shear test was carried out and the strength of the bond could reach 5.89 MPa.

本文言語English
ホスト出版物のタイトルProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
出版社IEEE Computer Society
ページ数1
ISBN(印刷版)9781479952618
DOI
出版ステータスPublished - 2014 1 1
イベント2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan
継続期間: 2014 7 152014 7 16

出版物シリーズ

名前Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Conference

Conference2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
国/地域Japan
CityTokyo
Period14/7/1514/7/16

ASJC Scopus subject areas

  • ろ過および分離

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